发明名称 |
A SEMICONDUCTOR DEVICE WITH MULTI LEVEL INTERCONNECTS AND METHOD OF FORMING THE SAME |
摘要 |
A semiconductor device and a method of manufacturing the semiconductor device are disclosed. An exemplary semiconductor device includes a substrate which includes a gate structure which separates a source and drain (S/D) feature. The semiconductor device further includes a first dielectric layer formed on a substrate. The first dielectric layer includes a first interconnect structure which electrically in contact with the S/D feature. The semiconductor device further includes a middle layer formed on the first dielectric layer. The middle layer comprises a top surface practically equal to the top surface of the first interconnect structure, and the semiconductor device further includes a second dielectric layer formed on the middle layer. The second dialectic layer includes a second interconnect structure electrically in contact with the first interconnect structure and a third interconnect structure electrically in contact with the gate structure. |
申请公布号 |
KR20140098639(A) |
申请公布日期 |
2014.08.08 |
申请号 |
KR20130033459 |
申请日期 |
2013.03.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIANG JENG MIN;WANG YING LANG;CHEN KEI WEI;LIU CHI WEN;WEI KUO HSIU;HUANG KUO FENG |
分类号 |
H01L21/768;H01L21/28 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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