发明名称 SLIP RING ASSEMBLY.
摘要 The invention relates to a method for repairing a gold wire-type slip ring assembly (200) which has a slip ring (202), in particular a gold ring for use with a gold wire printed circuit board (204) as the printed circuit board (204). The method has the following steps: - removing a gold wire printed circuit board (204) from the slip ring assembly (200); and - inserting a multiple-brush printed circuit board (304) in exchange for the gold wire printed circuit board (204).
申请公布号 MX2014008222(A) 申请公布日期 2014.08.08
申请号 MX20140008222 申请日期 2013.01.11
申请人 WOBBEN PROPERTIES GMBH 发明人 ALFRED BEEKMANN
分类号 H01R39/08;F03D1/00;H01R39/24;H01R43/14 主分类号 H01R39/08
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