| 摘要 |
A die bonding apparatus comprises: an indexer transporting a substrate and supplying a bonding area; a stage closely arranged to the indexer and supporting a wafer divided into a plurality of dies; a bonding head moving a gap between the stage and the indexer, picking up a die from the dicing tape, and bonding the die to the substrate on the bonding area; an imaging member facing the side of the indexer, arranged apart from a transporting route of the bonding head, and imaging lower portion of the die picked up to the bonding head; and a reflecting member arranged on the side of the indexer and delivering an image of the die picked up to the bonding head to the imaging member. |
