发明名称 |
APPARATUS FOR CLAMPING WAFER |
摘要 |
A wafer clamping apparatus according to the present invention comprises: a wafer mounting member in which a wafer is accommodated by mounting; a wafer support member moving upward and downward in the wafer mounting member; a straight line motion force generation member which applies a linear reciprocating motion force; a plate cam member designed to perform a reciprocating circular motion by the straight line motion applied by the straight line motion force generation member; and a clamping member designed to perform a linear reciprocating motion toward the center of the plate cam member by the reciprocating circular motion of the plate cam member. The present invention enables clamping wafers of various sizes while always fixing the center at a particular position, and heating the wafer while clamping. |
申请公布号 |
KR20140098575(A) |
申请公布日期 |
2014.08.08 |
申请号 |
KR20130011414 |
申请日期 |
2013.01.31 |
申请人 |
YEST CO., LTD. |
发明人 |
HAM, YOUNG JOON;SHU, MIN SUKE;BAIK, TAE HYUN;CHO, KYUNG HO;LIM, JUN WOO |
分类号 |
H01L21/687;B23Q3/06;H01L21/683 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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