COPPER FOIL WITH CARRIER, AND PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND COPPER-CLAD LAMINATE WITH USE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with carrier, which can sufficiently prevent the occurrence of blistering in an FPC due to the residue of gas or vapor generated by heating or the like.SOLUTION: A copper foil with carrier includes a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultra-thin copper layer laminated on the intermediate layer. The ultra-thin copper layer has pinholes with a diameter of 1μm or more and 50μm or less, at 1 piece/cmor more and 3000 pieces/cmor less.