| 发明名称 |
RADIO FREQUENCY GROUNDING SHEET FOR A PHASED ARRAY ANTENNA |
| 摘要 |
A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly. |
| 申请公布号 |
US2014218257(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201313757451 |
申请日期 |
2013.02.01 |
| 申请人 |
The Boeing Company |
发明人 |
Takeuchi Jimmy S.;Cameron Rodney D.;Heisen Peter T. |
| 分类号 |
H01Q1/52;H01P11/00 |
主分类号 |
H01Q1/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a cover including a plurality of waveguides; a pressure plate; a printed circuit board (PCB) comprising a plurality of radiating elements of an antenna array; and a first conductive sheet defining a first plurality of openings and including a first plurality of bumps, wherein one or more openings of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps, wherein the PCB and the first conductive sheet are positioned between the cover and the pressure plate. |
| 地址 |
US |
