| 摘要 |
The present invention relates to a silicone rubber composition for adhering a semiconductor chip (die) onto an SR-substrate and, more specifically, to a silicone rubber composition for adhering a semiconductor chip (die) which has improved reliability and adhesiveness by comprising a silicone resin having a vinyl group, hydrogenpolysiloxane, a tackifier, spherical silicone particles having a specific reactive functional group, an inorganic silica filler, a hydrosilylation reaction catalyst, and a reaction retardant. |
