发明名称 METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS
摘要 <p>PROBLEM TO BE SOLVED: To provide a packaging material which facilitates delivery and removal of a tacky product, such as a thermal interface pad, by thermal interface installation equipment.SOLUTION: A package for delivery of a tacky product having a base contact modulus of less than 50 Shore 00 comprises: a carrier tape having an upper surface and a plurality of cavities separately disposed in said upper surface along a length thereof, each of said cavities including a base that is sized to operably receive and support said product, said base having a base surface area and a surface profile defining a delineated first contact surface area that is less than 50% of said base surface area; and a cover tape having a first side removably securable to said upper surface of said carrier tape, said first side having a contact portion capable of contacting the product, said first side having a surface texture including an embossed portion defining a delineated second contact surface area that is less than 50% of said contact portion of said cover tape.</p>
申请公布号 JP2014141305(A) 申请公布日期 2014.08.07
申请号 JP20140037111 申请日期 2014.02.27
申请人 BERGQUIST CO:THE 发明人 RADESH JEWRAM;WILLIAM E MCINTOSH
分类号 B65D85/86;B65B15/04;B65D73/02 主分类号 B65D85/86
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