| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress signal transmission delay in a lamination type semiconductor device capable of selectively utilizing a plurality of through electrodes.SOLUTION: One interface chip IF and a plurality of core chips CC0 to CC7 are electrically connected through a plurality of through electrodes. A data signal of a driver circuit 401 is input to a core chip CC7 through either a through electrode 301 or 302. An output switching circuit 190 selects a through electrode by activating either a tristate inverter IVR1 or IVR2. The tristate inverter amplifies the data signal and transmits it to the through electrode. Similarly, an input switching circuit 192 activates either a tristate inverter IVT1 or IVT2. These tristate inverters also amplify the data signal output from the through electrode and transmits them to a receiver circuit 411.</p> |
