| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing device capable of efficiently polishing a peripheral edge part and a rear face outer peripheral part of a semiconductor wafer.SOLUTION: A polishing device comprises: a first polishing mechanism for polishing a rear face outer peripheral part of a semiconductor wafer (2) placed on a mounting base (1) rotating by a rotation mechanism; and a second polishing mechanism for polishing a peripheral edge part of the semiconductor wafer. A polishing tape (4) used for polishing the rear face outer peripheral part of the semiconductor wafer is cleaned by a cleaning mechanism (30), and then, used for polishing the peripheral edge part of the semiconductor wafer.</p> |
