| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead-free solder having a low melting point than that of a lead solder and also having excellent fatigue resistance without using Ag, In or Sb.SOLUTION: A lead-free solder contains: Bi added in an amount of 20-60 mass%; one or more element selected from Cu, Ni and P, with the selected Cu being added in an amount of 0-3 mass%, the selected Ni being added in an amount of 0.005-0.5 mass%, and the selected P being added in an amount of 0.005-0.05 mass%; and the balance of Sn and unavoidable impurities.</p> |
