| 摘要 |
A polyimide film suitable for insulating material is prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a TAB tape employing a polyimide film, and a flexible printed wiring board. |
| 主权项 |
1. A polyimide film produced from a polyamic acid, said polyamic acid being prepared by reacting monomer components consisting of:
(i) an acid anhydride, and (ii) diamine compounds, wherein the acid anhydride is selected from the group of promellitic dianhydride, a mixture of pyromellitic dianhydride and 3,3′,4,4′-benzophenone tetracarboxylic dianhydride, and a mixture of pyromellitic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride, wherein the diamine compounds comprise p-phenylenediamine, and at least one diamine compound selected from the group consisting a diamine compound including an ether linkage between an H2N—C bond and another H2N—C bond in the molecule, a diamine compound including a methylene linkage between an H2N—C bond and another H2N—C bond in the molecule, and a diamine compound having a structure wherein an H2N—C bond and another H2N—C bond are not linearly arranged; and wherein the polyimide film has an average coefficient of linear expansion in the range of 50° C. to 300° C. of 6 to 30 ppm, a tensile modulus of 2.0 GPa or more, and a coefficient of hygroscopic expansion of 13 ppm or less. |
