MOUNTING METHOD AND MOUNTING DEVICE

摘要

An objective of the present invention is to provide a mounting method and a mounting device whereby, even if the range wherein a chip component is mounted upon a substrate increases, the chip component is mounted with high precision upon a prescribed location of the substrate. Specifically, provided are a mounting method and a mounting device wherein, after alignment marks of a chip component and alignment marks of a substrate are recognized with an image recognition means and an alignment of the chip and the substrate is carried out, a mounting offset, whereby a degree of location misalignment arising when the chip component is pressure mounted is offset, is set as a function of a location within a substrate retaining stage surface whereupon the substrate is retained, and a pressure force at time of bonding.