| 摘要 |
SEMICONDUCTOR DEVICE MODULE A semiconductor device module (30) is provided. The semiconductor device module comprises a plurality of a rod-shaped semiconductor devices (20) arranged in a planar column when connected in series. Each of the plurality of rod-shaped semiconductor devices (20) has a light receiving function, and comprises: a rod-shaped substrates made of a p-type or n-type semiconductor crystal having a circular or near-circular cross section; a separate conductive layer (5), which is formed on a part of a surface of said substrate excluding a band-shaped part parallel to an axis of said substrate, and which has different conduction type from that of said substrate; a near-cylindrical pn-junction (6) formed with by said substrate and said separate conductive layer; a band-shaped first electrode ohrnic-connected to a surface of said band-shaped part on said substrate; and a band-shaped second electrode ohmic-connected to a surface of said separate conductive layer on an opposite side of said first electrode across the axis of said substrate, wherein for said each one rod-shaped semiconductor device, said first electrode is one of a positive or negative electrode and said second electrode is the other of a positive or negative electrode; wherein for each two adjacent serially connected rod-shaped semiconductor devices in said column, the positive electrode of one rod-shaped semiconductor device is electrically connected to an adjacent negative electrode of an adjacent rod-shaped semiconductor device via a thin metallic plate (31). |
