SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To make it easy to perform various types of inspection such as analysis by using different materials used for bonding wires; and improve a security function by using different materials used for bonding wires.SOLUTION: A semiconductor device comprises: a stage 1; a first lead 2A; a second lead 2B; a semiconductor chip 3 which is mounted on the stage and has a first bonding pad 4A and a second bonding pad 4B; a first bonding wire 5A for connecting the first bonding pad and the first lead; a second bonding wire 5B for connecting the second bonding pad and the second lead; and an encapsulation resin 6 for encapsulating the semiconductor chip. The first bonding wire is composed of a first metal which is not melted by a medicinal solution which dissolves the encapsulation resin at the time of opening and the second bonding wire is composed of a second metal which is melted by the medicinal solution which dissolves the encapsulation resin at the time of opening.