CENTERING GUIDE FOR WAFERS OF DIFFERENT SIZES

摘要

An apparatus for centering workpieces of different sizes, particularly wafers, featuring a single plane centering guide. The guide features a plate having a cutout region with a first arcuate cutout within which a portion of a circumference of a first circular workpiece is nestable and a second arcuate cutout adjacent to and deeper than the first arcuate cutout and centered along the cutout region within which a portion of a circumference of a smaller second circular workpiece is nestable. The arcuate cutouts and nested workpiece have centers of curvature along a common centerline that are collinear with a linear path. The workpiece delivery device horizontally moveable along the linear path, delivers a workpiece to the nesting position thereby centering the workpiece relative to the first or second arcuate cutout. From the centered position, the workpiece delivery device may deliver the workpiece to a predetermined position.

主权项

1. An apparatus for centering circular workpieces of different sizes received along a linear path, comprising:
a plate having a cutout region with a first arcuate cutout within which a portion of a circumference of a first circular workpiece is nestable and a second arcuate cutout adjacent to the first arcuate cutout and centered along the cutout region, said second arcuate cutout disposed deeper than said first arcuate cutout and within which a portion of a circumference of a smaller second circular workpiece is nestable, wherein the first and second arcuate cutouts have centers of curvature along a common centerline that is collinear with the linear path, and wherein said linear path delivers the workpiece to a nesting position with either the first or second arcuate cutouts thereby centering the workpiece relative to the first or second arcuate cutout.