| 发明名称 |
Heat Sink Package |
| 摘要 |
Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same.;The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate. |
| 申请公布号 |
US2014217572(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201314078346 |
申请日期 |
2013.11.12 |
| 申请人 |
Fairchild Korea Semiconductor, Ltd. |
发明人 |
Eom Joo-Yang;Jeon O-seob;Lim Seung-Won;Choi Seung-Yong |
| 分类号 |
H01L23/367;H01L23/00 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat sink package comprising:
a heat sink having a cavity on an upper surface thereof: a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; and a semiconductor package on the solder paste layer. |
| 地址 |
Bucheon-Si KR |
