MEMS Device With Stress Relief Structures

摘要

An encapsulated MEMS device includes stress-relief trenches in a region of its substrate that surrounds the movable micromachined structures and that is covered by a cap, such that the trenches are fluidly exposed to a cavity between the substrate and the cap. A method of fabricating a MEMS device includes fabricating stress-relief trenches through a substrate and fabricating movable micromachined structures, and capping the device prior art encapsulating the device.

主权项

1. A MEMS device comprising:
a substrate having a top surface and a peripheral region; a beam support structure coupled to the substrate, the beam support structure circumscribed by the peripheral region; a cap coupled to the top surface of the substrate and surrounding the peripheral region, the cap sealed to the top surface and creating a cap void between the cap and the top surface; a released movable MEMS structure suspended from the beam support structure and exposed within the MEMS volume; a stress-relief trench within in the peripheral region, the stress-relief trench extending into the top surface and in fluid communication with the cap void.