发明名称 |
CONDUCTIVE PARTICLE, PRODUCTION METHOD THEREOF, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle which can reduce the connection resistance when used in an electrical connection between electrodes. ! SOLUTION: A conductive particle 1 comprises: a substrate particle 11; and a conductive layer 22 which is arranged on the surface of the substrate particle 11 and contains copper and tin. The conductive particle 1 is obtained by using a before-treatment particle in which a copper plated layer is arranged on the surface of the substrate particle 11, the outer surface of the copper plated layer of the before-treatment particle being subjected to substitution plating with tin. ! COPYRIGHT: (C)2014,JPO&INPIT |
申请公布号 |
JP2014143189(A) |
申请公布日期 |
2014.08.07 |
申请号 |
JP20130265584 |
申请日期 |
2013.12.24 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
SAITO SATOSHI |
分类号 |
H01B5/00;C09J9/02;C09J201/00;H01B1/00;H01B1/22;H01B5/16;H01B13/00;H01R11/01;H01R43/00 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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