| 摘要 |
This method for manufacturing a light-emitting device (1) has a frame formation step, a bump formation step, a first bonding step, a second bonding step, and a sealing step. A frame (2) is formed in the frame formation step. Said frame (2) contains the following: a device substrate (4) on which a light-emitting element (20) is mounted; and a terminal section (5) that is isolated from the device substrate (4) and is electrically connected to the light-emitting element (20) via a wire (6a). The vertical distance (H1) from the surface of the terminal section (5) to which the wire (6a) is connected to the top edge (2a) of the frame (2) is less than the vertical distance (H2) from the top surface of the light-emitting element (20) to the top edge (2a) of the frame (2). In the bump formation step, a bump (32) is formed on the electrode of the light-emitting element (20) to which the wire (6a) is connected. One end of the wire (6a) is first joined to the terminal section (5) in the first bonding step, and the other end of the wire (6a) is then joined to the bump (32) in the second bonding step. In the sealing step, the interior of the frame (2) is filled with a sealant (7) so as to seal the light-emitting element (20). |
