| 摘要 |
<p>A top package (100) used in a PoP (package-on-package) package includes two memory dies (102A, 102B) stacked with a redistribution layer (RDL) between the die. The first memory die (102A) is encapsulated in an encapsulant (104) and coupled to a top surface of the RDL (106). A second memory die (102B) is coupled to a bottom surface of the RDL. The second memory die is coupled to the RDL with either a capillary underfill material or a non-conductive paste. The RDL includes routing between each of the memory die and one or more terminals (112A, 112B) coupled to the RDL on a periphery of the die.</p> |
