Carrier for supporting semiconductor substrate, used for chuck in prober for testing test substrate, has control device which reduces adhesion of micro-structured surface formed in support surface for supporting substrate

摘要

The carrier has a support surface for placing the semiconductor substrate and a holding unit for fixing the semiconductor substrate. The support surface is provided with several microstructures formed by projections, so that the end faces of the projections form a structured adhesive surface. A control device is provided for reducing the adhesion of the micro-structured surface. Independent claims are included for the following: (1) chuck for receiving and holding test substrate; and (2) prober for testing test substrates.