| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of an adhesive layer from a self-adhesive layer of a self-adhesive tape. SOLUTION: A wafer processing tape 1 comprises a pressed part 20 provided on the peripheral parts 34, 36 of an adhesive layer 3. A peel force at each of the peripheral parts 34, 36 of the adhesive layer 3 is larger than a peel force at the scheduled bond part 30 of the adhesive layer 3 to which a semiconductor wafer W is to be bonded. The peel force at each of the peripheral parts 34, 36 is 0.5 N/25 mm and over. COPYRIGHT: (C)2013,JPO&INPIT |
