| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip mounting device capable of reducing a production tact time and mounting a chip of an integrated circuit element and the like on a substrate such as a printed circuit board with high reliability.SOLUTION: A chip mounting device comprises: chip holding means for adsorption-holding a chip; pressure application means having a function for supporting the chip holding means and making a pressing force applied to the chip holding means to a desired value regardless of elongation or shrinkage due to heating and cooling of chip pressure application means; and drive control means for making the pressure application means movable in a device height direction. A bump of the chip is solder-jointed to an electrode of a substrate arranged at a position opposed to the chip. The chip mounting device comprises prediction control means for predicting an elongation amount of the chip holding means until the bump of the chip is molten from heating of the chip holding means, inputting a correction command to the drive control means based on a prediction value of the elongation of the chip holding means, and controlling a height position of the pressure application means. |
