| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching rate measuring apparatus capable of measuring the etching rate with high accuracy by a simple configuration. ! SOLUTION: An glass plate 3 to be etched is installed in a chemical 1a in an etching bath 1 in a manner that a pair of sensors 5a for measuring the capacitance faces toward both side faces of the glass plate 3. Each sensor 5a is pressed in the direction of the glass plate 3 by means of spring scissors 7. Since the glass plate 3 becomes thin by etching and the distance between the sensors 5a is shortened to change the capacitance, the etching rate can be calculated from the change in the capacitance thus measured with time, by using a predetermined relational expression of the glass thickness and the capacitance. ! COPYRIGHT: (C)2014,JPO&INPIT |
