| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of avoiding increase in area of an IC chip, and of being applied to copper wire bonding by which no damage is given to a circuit element.SOLUTION: A semiconductor device comprises a probe pad region and a bonding pad region used for bonding connection by a copper wire, that are electrically connected with each other. At a lower part of the probe pad region, a circuit element contributing to a circuit operation of the semiconductor device is formed. At a lower part of the bonding pad region, no circuit element contributing to the circuit operation of the semiconductor device is formed. Due to this configuration, an adhesion property between the wire bonding and the bonding pad region can be improved, and damage to the circuit element formed at the lower part of the probe pad region can be avoided. Further, even if damage is given to the lower part of the bonding pad region at the wire bonding, influences to a yield of IC products can be reduced. |
