发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition having high fluidity and retention stability and capable of obtaining a molding having excellent thermal aging resistance and metal adhesion. ! SOLUTION: Provided is a polyamide resin composition obtained by blending, to 100 pts.of (A) a polyamide resin, (B) a branched compound having three or more amino groups in one molecule by 0.1 to 10 pts.wt., and in which the ratio of the molecular weight of the primary amino group per molecule to the molecular weight of the branched compound having three or more amino groups in one molecule (the molecular weight of the primary amino group/the molecular weight of the compound) satisfies 0.001 to 0.19. ! COPYRIGHT: (C)2014,JPO&INPIT
申请公布号 JP2014141630(A) 申请公布日期 2014.08.07
申请号 JP20130146045 申请日期 2013.07.12
申请人 TORAY IND INC 发明人 NISHIDA SHINGO ; AKITA DAI ; UMEZU HIDEYUKI
分类号 C08L77/00;B29B7/46;B29B7/88;B29K77/00;C08K3/08;C08K3/10;C08K5/17;C08L71/02 主分类号 C08L77/00
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