发明名称 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS
摘要 A substrate holder has two holder constituting bodies, each having a plurality of columns arranged on an imaginary circle, and substrate holding sections that hold circumferential portions of respective substrates. The holder constituting bodies hold the substrates so that either their front surfaces or their back surfaces face upward with a substrate having an upward facing front and a substrate having an upward facing rear being alternately arranged in a vertical direction. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other. A distance between a first pair of vertically adjacent substrates with their respective front surfaces facing each other is set to ensure treatment uniformity, and to be larger than a distance between a second pair of vertically adjacent substrates with their respective back surfaces facing each other.
申请公布号 US2014220503(A1) 申请公布日期 2014.08.07
申请号 US201414250131 申请日期 2014.04.10
申请人 TOKYO ELECTRON LIMITED 发明人 INOUE Hisashi;MATSUMOTO Shunichi;TAKEUCHI Yasushi
分类号 H01L21/673;H01L21/67 主分类号 H01L21/673
代理机构 代理人
主权项
地址 Tokyo-To JP