CIRCUIT ON A THIN CARRIER FOR USE IN HOLLOW CONDUCTORS, AND PRODUCTION METHOD

摘要

A substrate-based circuit (31) has a carrier substrate (2), wherein an adhesive layer (5) is formed on at least one part of the carrier substrate (2), and a contact layer (6) is formed on at least one first part (51) of the adhesive layer (5), said contact layer forming at least one conductor track (7) and/or at least one antenna element (8). The carrier substrate (2) has at least one securing element (20) which is deposited on the outer region of the carrier substrate (2) and which protrudes beyond the outer region of the carrier substrate (2).