| 摘要 |
<p>The present invention relates to a heating socket for testing and, more specifically, to a heating socket for testing which includes: a base assembly to install an adaptor to mount a semiconductor element to be tested; a heater pad to heat the semiconductor element mounted on the adaptor; a connector to electrically connect the heater pad and a main board; and a shield line to remove noise from a connection signal of the semiconductor element. In order for the shield line to penetrate, an installation hole is formed in the base assembly. A fixing unit which is inserted into the installation hole to fix the shield line is further included. According to the present invention described above, since the heat from the heater pad is discharged to the outside while the semiconductor element is mounted and tested, the present invention is able to prevent heat from being conducted to the connector through the shield line, differently from existing technologies, and accordingly prevent malfunction, thereby improving accuracy in testing the semiconductor element.</p> |
