发明名称 METHOD OF FORMING EXTERNAL TERMINALS OF A PACKAGE AND APPARATUS FOR PERFORMING THE SAME
摘要 A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.
申请公布号 US2014220774(A1) 申请公布日期 2014.08.07
申请号 US201414171992 申请日期 2014.02.04
申请人 Samsung Electronics Co., Ltd 发明人 EUM Yo-Se;KIM Sang-Geun;LEE Seok-Yong
分类号 H01L23/00;H01L21/683 主分类号 H01L23/00
代理机构 代理人
主权项 1. A method of forming external terminals of a package, the method comprising: fixing a package substrate of the package; supporting an edge portion of the package substrate to prevent the edge portion of the package substrate from being upwardly bent; arranging a mask having a plurality of openings on the package substrate; and providing the external terminals to the package substrate through the plurality of openings of the mask.
地址 Suwon-si KR