摘要 |
The present invention relates to an LED substrate, a manufacturing method thereof, and an LED package including the LED substrate. The method for manufacturing the LED substrate according to the present invention includes the steps of: preparing a ceramic substrate which includes a first substrate and a second substrate; forming an oxide layer on at least one surface of the first surface and the second surface; and forming an external electrode layer on the surface of the oxide layer. According to the present invention, the oxide layer is formed on the ceramic substrate before an external electrode layer is installed. The formed oxide layer has high reflectivity and attachment intensity. Thereby, the luminous efficiency of an AlN substrate is maximized. |