发明名称 LED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME AND LED PACKAGE COMPRISING THE SAME
摘要 The present invention relates to an LED substrate, a manufacturing method thereof, and an LED package including the LED substrate. The method for manufacturing the LED substrate according to the present invention includes the steps of: preparing a ceramic substrate which includes a first substrate and a second substrate; forming an oxide layer on at least one surface of the first surface and the second surface; and forming an external electrode layer on the surface of the oxide layer. According to the present invention, the oxide layer is formed on the ceramic substrate before an external electrode layer is installed. The formed oxide layer has high reflectivity and attachment intensity. Thereby, the luminous efficiency of an AlN substrate is maximized.
申请公布号 KR101427636(B1) 申请公布日期 2014.08.07
申请号 KR20130039169 申请日期 2013.04.10
申请人 AMOSENSE CO., LTD. 发明人 WOO, KYUNG WHAN;DAN, SUNG BAEK
分类号 H01L33/48;H01L33/60 主分类号 H01L33/48
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