发明名称 CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin composition with good solution stability which, for example, when used by being processed into a conductive sheet, has good heat resistance and is capable of suppressing deterioration in conductivity and adhesiveness for a long period of time.SOLUTION: The conductive resin composition contains: a thermosetting resin having an acid value of 5-90 mgKOH/g; conductive fine particles each formed by coating a conductive metal core with a conductive material different from the metal core; and a compound having a bond unit of a specific structure. Preferably, the compound having a unit represented by chemical formula (1) is contained in an amount of 0.5-10 pts.wt. based on 100 pts.wt. of the conductive fine particles.
申请公布号 JP2014141628(A) 申请公布日期 2014.08.07
申请号 JP20130125640 申请日期 2013.06.14
申请人 TOYO INK SC HOLDINGS CO LTD 发明人 HAYASAKA TSUTOMU;MORI SHOTA;NISHIYAMA YUJI;TAKAHASHI MASAKATSU
分类号 C08L101/00;B32B7/02;B32B27/00;C08J5/18;C08K3/08;C08K5/24;C08K9/02;C08K9/04;H01B1/00;H01B1/22;H01B5/02;H01B5/14 主分类号 C08L101/00
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