发明名称 |
CONDUCTIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition with good solution stability which, for example, when used by being processed into a conductive sheet, has good heat resistance and is capable of suppressing deterioration in conductivity and adhesiveness for a long period of time.SOLUTION: The conductive resin composition contains: a thermosetting resin having an acid value of 5-90 mgKOH/g; conductive fine particles each formed by coating a conductive metal core with a conductive material different from the metal core; and a compound having a bond unit of a specific structure. Preferably, the compound having a unit represented by chemical formula (1) is contained in an amount of 0.5-10 pts.wt. based on 100 pts.wt. of the conductive fine particles. |
申请公布号 |
JP2014141628(A) |
申请公布日期 |
2014.08.07 |
申请号 |
JP20130125640 |
申请日期 |
2013.06.14 |
申请人 |
TOYO INK SC HOLDINGS CO LTD |
发明人 |
HAYASAKA TSUTOMU;MORI SHOTA;NISHIYAMA YUJI;TAKAHASHI MASAKATSU |
分类号 |
C08L101/00;B32B7/02;B32B27/00;C08J5/18;C08K3/08;C08K5/24;C08K9/02;C08K9/04;H01B1/00;H01B1/22;H01B5/02;H01B5/14 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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