SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, LEAD, AND METHOD OF MANUFACTURING LEAD

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: A semiconductor device comprises: an FET chip 10; a plurality of pads 12-16 provided on an upper surface 11 of the FET chip 10; a plurality of bumps 40 provided on at least one of the pads 12-16; a first portion 44 to which the FET chip 10 is connected through the bumps 40, and which extends along the upper surface 11 of the FET chip 10; a second portion 46 which is in contact with a surface 41 along the upper surface 11 of the FET chip 10 in the first portion 44, and which extends along a side surface 13 of the FET chip 10; leads 42a-42c formed by press work or cutting work; and a sealing portion 48 which seals the FET chip 10 and the leads 42a-42c, and which exposes the second portions 46 of the leads 42a-42c from the side of a lower surface 15 of the FET chip 10.