BONDING DEVICE AND BONDING SYSTEM

摘要

PROBLEM TO BE SOLVED: To suppress deformation of bonded substrates in a vertical direction while appropriately holding the substrates when bonding the substrates with each other.SOLUTION: A bonding device comprises an upper chuck 230 which vacuums an upper wafer Wto suck and hold the wafer and a lower chuck 231 which vacuums a lower wafer Wto suck and hold the wafer. The upper chuck 230 comprises: a body part 240 which vacuums the upper wafer W; a plurality of pins 241 which come into contact with a rear surface of the upper wafer W; and an outer wall part 242 annularly provided outside the plurality of pins 241 and supporting an outer peripheral part of the rear surface of the upper wafer W. The lower chuck 231 comprises: a body part 270 which vacuums the lower wafer W; a plurality of pins 271 which come into contact with a rear surface of the lower wafer W; and an outer wall part 272 annularly provided outside the plurality of pins 271 and supporting an outer peripheral part of the rear surface of the lower wafer W.