| 发明名称 |
PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSTION, AND DRY FILM SOLDER RESIST |
| 摘要 |
The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator. |
| 申请公布号 |
US2014221519(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201414245184 |
申请日期 |
2014.04.04 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
KU Se-Jin;CHOI Byung-Ju;JEONG Woo-Jae;CHOI Bo-Yun;LEE Kwang Joo;JEONG Min-Su |
| 分类号 |
C08G73/00 |
主分类号 |
C08G73/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A photo-curable and thermo-curable resin composition, comprising:
an acid-modified oligomer comprising an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photo-initiator. |
| 地址 |
Seoul KR |
