| 发明名称 |
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate. |
| 申请公布号 |
US2014220743(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201414252780 |
申请日期 |
2014.04.15 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Yoo Do Jae;Lee Young Ki;Suh Bum Seok;Chae Joon Seok |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. (canceled) |
| 地址 |
Suwon-Si KR |
