发明名称 |
POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME |
摘要 |
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames. |
申请公布号 |
US2014220736(A1) |
申请公布日期 |
2014.08.07 |
申请号 |
US201414244834 |
申请日期 |
2014.04.03 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Kim Kwang Soo;Park Ji Hyun;Lee Young Ki;Choi Seong Moon |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. (canceled) |
地址 |
Suwon-si KR |