发明名称 COMPONENT-EMBEDDED RESIN SUBSTRATE
摘要 A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.
申请公布号 US2014218884(A1) 申请公布日期 2014.08.07
申请号 US201414246682 申请日期 2014.04.07
申请人 MURATA MANUFACTURING CO., LTD. 发明人 Sakai Norio;Otsubo Yoshihito
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
主权项 1. A component-embedded resin substrate, comprising: a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of said resin layers; and a plurality of embedded components arranged as embedded in said resin structure, said plurality of embedded components including a first embedded component and a second embedded component, said first embedded component having a first outer side extending along a portion of said end surface closest to said first embedded component when viewed in a planar view, said second embedded component having a second outer side extending along a portion of said end surface closest to said second embedded component when viewed in a planar view, and said first outer side being oblique to said second outer side when viewed in a planar view.
地址 KYOTO-FU JP