| 摘要 |
PROBLEM TO BE SOLVED: To provide an excellent thermal bonding device in which the temperature of a thermally bonded object does not overshoot significantly from a predetermined target temperature suitable for thermal bonding when performing thermal bonding, e.g., soldering in the vacuum, and the temperature of the object can be brought to the predetermined target temperature in a shorter time when compared with conventional device and method, and a method of manufacturing thermally bonded product.SOLUTION: A thermal bonding device includes a vacuum chamber for housing a thermally bonded object and a buffer section, a heater arranged in contact with the object housed in the vacuum chamber and heating the buffer section, a cooler for exhausting heat in the buffer section heated by means of the heater, an object temperature sensor for detecting the temperature of the object heated via the buffer section, and a controller for controlling the temperature of the object to a predetermined target temperature suitable for thermal bonding, based on the temperature of the object thus detected, by adjusting exhaustion of heat from the buffer section by means of the cooler. |
