| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for temporal fixing which can form a coating film for a support member having a low-adhesion surface, can fix a semiconductor wafer and the support member sufficiently, has a sufficient heat resistance, and yet can separate the semiconductor wafer processed from the support member easily, and to provide a method of manufacturing a semiconductor device using the resin composition for temporal fixing. ! SOLUTION: A resin composition for temporal fixing used in the method of manufacturing a semiconductor device including a semiconductor element, obtained by interposing the resin composition between a support member and a semiconductor wafer and processing and individualizing the semiconductor wafer, contains a polyamide-imide resin obtained by polycondensation of aromatic tricarboxylic acid or a reactive acid derivative thereof and α, ω-bis(3-aminopropyl)-polydimethyl siloxane and aromatic diamine. ! COPYRIGHT: (C)2014,JPO&INPIT |
