ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS

摘要

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

主权项

1. An adhesive composition, comprising:
a curable resin component; a curing agent; and a block copolymer additive comprising hydrophobic segments and hydrophilic segments, wherein the glass transition temperature of the block copolymer additive is at least about 40° C.; and a composition comprising: a first epoxy component; a second silane-modified epoxy component, wherein the second silane-modified epoxy component arises from reaction of an aromatic epoxy resin and an epoxy silane in a weight ratio of from about 1:10 to about 10:1,wherein the epoxy silane is embraced by the following structure:
R1—Si(OR2)3 wherein R1 is an oxirane-containing moiety and R2 is an alkyl or alkoxy-substituted alkyl, aryl or aralkyl group having from 1 to ten carbon atoms.