THERMAL MANAGEMENT IN LASER DIODE DEVICE

摘要

Embodiments are disclosed that relate to reducing inductive losses and controlling driver and laser diode temperatures in an optical assembly comprising a laser diode. For example, one disclosed embodiment provides an optical assembly comprising a printed circuit board, and a laser diode package and laser diode driver mounted to the printed circuit board. Further, a heat sink is coupled to the laser diode driver and configured to provide a first thermal path for conducting heat from the laser diode driver. Additionally, a coupler may further be coupled to the laser diode package and printed circuit board, wherein the coupler is configured to provide a second, different thermal path for conducting heat from the laser diode package.

主权项

1. An optical assembly comprising:
a printed circuit board; a laser diode package mounted to the printed circuit board; a laser diode driver mounted to the printed circuit board; a heat sink coupled to the laser diode driver, the heat sink configured to provide a first thermal path for conducting heat from the laser diode driver; and a coupler coupled to the laser diode package, the coupler configured to provide a second, different thermal path for conducting heat from the laser diode package.