HEAT DISSIPATION DEVICE LOADING MECHANISMS

摘要

The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic assembly with a loading mechanism having at least one outrigger that is rotatable or pivotable between a first position and a second position to accommodate different heat dissipation device sizes or shapes.

主权项

1. A heat dissipation device loading mechanism, comprising:
a loading mechanism body; and
at least one outrigger pivotally attached to the loading mechanism, wherein the outrigger is pivotal between a first position and a second position.