SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME

摘要

The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase.

主权项

1. A substrate structure comprising:
a plurality of conductive regions, wherein each two adjacent conductive regions are separated by an isolation border; a connection structure along at least one side of the substrate structure, wherein the connection structure is electrically connected with at least two conductive regions of the plurality of conductive regions and is in contact with at least one isolation border and each of which is adjacent to at least one of the at least two conductive regions.