MULTILAYER WIRING SUBSTRATE

摘要

To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole.

主权项

1. A multilayer wiring board, comprising:
a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered, at least one layer that has a plurality of through hole among the resin insulating layers; a conformal type conductor disposed in each of the plurality of through holes, the conformal type conductor that electrically connects between the conductor layers; and an anchor portion formed by filling up a part of the resin insulating layer layered at an upper layer side, inside of the conformal type conductor, wherein the anchor portion includes a lower end side and an upper end side, the lower end side that bulges larger than the upper end side in a radially outward direction of the through hole.