SILICON WAFER CLEANING METHOD

摘要

A silicon wafer cleaning method is provided. Firstly, a silicon wafer is provided. Then, a polymer cleaning step is performed to clean a surface of the silicon wafer. After the polymer cleaning step, a deionized water/carbon dioxide gas discharging step is performed, so that the charges accumulated on the surface of the silicon wafer can be instantly removed. After the deionized water/carbon dioxide gas discharging step, two or more particle removing steps are performed. In addition, an air-jet step is performed during the time interval between every two sub-steps of a single particle removing step. Consequently, the cleaning efficiency of removing the particles will be enhanced.

主权项

1. A silicon wafer cleaning method, comprising steps of:
providing a silicon wafer; performing a polymer cleaning step to clean a surface of the silicon wafer; performing a deionized water/carbon dioxide gas discharging step to clean the surface of the silicon wafer after the polymer cleaning step; and performing a particle removing step and an air-jet step to clean the surface of the silicon wafer after the deionized water/carbon dioxide gas discharging step.