| 摘要 |
<p>PURPOSE: A semiconductor package aggregate alignment method is provided to automatically set a position correction weighted value in a preliminary alignment part by considering an alignment error value, thereby rapidly and accurately performing an alignment process of a package aggregate. CONSTITUTION: A position value with respect to the central point of a chuck table is calculated(S1). A package aggregate in which an alignment process is completed is mounted on the chuck table(S2). A position value with respect to a reference mark of the package aggregate is acquired(S3). An alignment error of the chuck table and the package aggregate is calculated(S4). A position correction weighted value of a preliminary alignment part is established(S5).</p> |
