| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing carrier and a polishing device for preventing a contour portion of a wafer from becoming thick in polishing, and precisely polishing the wafer.SOLUTION: A polishing carrier 1 is equipped with a work holding hole 10 having a projecting portion 12a at least at a part of an inner peripheral end surface 11. The projecting portion 12a surrounding a wafer forms a slurry sump, and slurry is easily supplied to a wafer contour portion. Therefore, the wafer can be further precisely machined. |
