发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
摘要 |
An electrode pad is provided above a circuit block of a semiconductor integrated circuit device. A junction point A and a junction point B are provided on connection lines connecting electrode pads to an internal circuit and an electrostatic discharge (ESD) protection circuit. The junction point A and the junction point B are positioned at locations closer to the ESD protection circuit than to the electrode pads. |
申请公布号 |
US2014218831(A1) |
申请公布日期 |
2014.08.07 |
申请号 |
US201414249170 |
申请日期 |
2014.04.09 |
申请人 |
PANASONIC CORPORATION |
发明人 |
MATSUI Tooru;HIROFUJI Masanori;KUMASHIRO Yoshifumi;NARUSE Tatsuya;SEGAWA Hiroaki |
分类号 |
H02H9/04;H01L27/02 |
主分类号 |
H02H9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Osaka JP |